| Qhov project | Cov ntsiab lus | Capabibty |
| 1 | pawg thawj coj saib xyuas | Aluminium Base, Copper Base, Ceramics Base tooj liab, Combined Bade Board |
| 2 | khoom | Khoom siv hauv tsev.Aumestic tooj liab, imported aluminium, imported tooj liab |
| 3 | kho saum npoo | HASL/ENIG/OSP/sikering |
| 4 | txheej account | ib leeg-sided pnnted board / ob-sided luam ntawv board |
| 5 | Maxi.Board Loj | 1200mm * 480m (n |
| 6 | min. Board Loj | 5mm * 5 hli |
| 7 | kab dav / apsce | 0.1mnV 0.1 hli |
| 8 | warp thiab twist | <= 0.5% (tfiickness: 1 .Omm, Board Loj: 300mm * 300mm) |
| 9 | Board thickness | 0.5mm-5.0 hli |
| 10 | tooj liab foil thickness | 35urrV70um/105um/140um/175umV210um/245um/280um/315um/35Qjm |
| 11 | kam rau ua | CNC routing: ± 0.1 hli; Punch: ± 0.1 hli |
| 12 | V-CUT sau npe | ± 0.1 hli |
| 13 | Qhov phab ntsa tooj liab thickness | 20-35 hli |
| 14 | mm sau npe ntawm qhov chaw (campare nrog CAD cov ntaub ntawv) | ± 3mil (10.076 hli) |
| 15 | Min. punching qhov | 1.0mm (Pib thickness bebw1.0mmr1.0 hli) |
| 16 | Min. punching square qhov | (Pib thickness hauv qab 1 .Omm, 1.0mm * 1 .Omm) |
| 17 | Kev sau npe ntawm cov ntawv luam tawm | ± 0.076 hli |
| 18 | Min.drill qhov taub | 0.6mm ib |
| 19 | thickness ntawm kev kho deg | Plating kub: Ni 4um-6um>Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umsilvering: Ag3um-8umHASL: 40um-1 OOum |
| 20 | V-CUTdegree kam rau ua | (Degree) |
| 21 | V-CUT board thickness | 0.6mm-4.0 hli |
| 22 | Min.lus dab neeg dav | 0.15 hli |
| 23 | Min.Soldor daim npog qhov ncauj qhib | 0.35 hli |