Kev Sib Tw PCB Chaw Tsim Tshuaj

Txheeb khoom Muaj peev xwm li qub Muaj peev xwm tshwj xeeb

txheej txheej suav

Rigid-flex PCB 2-14 2-24
  Flex PCB 1-10 1-12

txiag

  0.08 +/- 0.03 hli 0.05 +/- 0.03mm
  Min. Thickness    
  Max. Thickness 6 hli 8 hli
  Max. Qhov Coob 485mm * 1000mm 485mm * 1500mm
Qhov & Qhov Min.Hole 0.15 hli 0.05 hli
  Min.Slot Qhov 0.6 hli 0.5 hli
  Xam tus piv

10:01

12:01

Ib txoj lw Min.Width / Chaw 0.05 / 0.05 hli 0.025 / 0.025 hli
Kam rau ua Ib Txoj lw W / S 0.03 hli 0.02mm
    (W / S≥0.3mm: ± 10%) (W / S≥0.2mm: ± 10%)
  Lub qhov 0.075mm 0.05mm
  Qhov Qhov Loj 0.075mm 0.05mm
  Txhim nyog 0 ≤ Muaj nqi ≤ 50Ω: ± 5Ω 50Ω ≤ Tus nqi: ± 10% Ω  
Cov khoom siv Basefilm Specification PI: 3mil 2mil 1mil 0.8mil 0.5mil  
    ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ  
  Basefilm Tus neeg muag khoom tseem ceeb Shengyi / Taiflex / Dupont / Doosan / Thinflex  
  Coverlay Kev Qhia Txog PI: 2mil 1mil 0.5mil  
  LPI Xim Ntsuab / Daj / Dawb / Dub / Xiav / Liab  
  PI Stiffener T: 25um ~ 250um  
  FR4 Stiffener T: 100um ~ 2000um  
  SUS Stiffener T: 100um ~ 400um  
  AL Stiffener T: 100um ~ 1600um  
  Daim kab xev 3M / Tesa / Nitto  
  EMI tiv thaiv Nyiaj zaj duab xis / tooj liab / Nyiaj kua xim  
Deg tas OSP 0.1 - 0.3um  
  HASL Sn: 5um - 40um  
  HASL (Leed dawb) Sn: 5um - 40um  
  ENEPIG Ni: 1.0 - 6.0um  
    Ba: 0.015-0.10um  
    Au: 0.015 - 0.10um  
  Plating nyuaj kub Ni: 1.0 - 6.0um  
    Au: 0.02um - 1um  
  Flash kub Ni: 1.0 - 6.0um  
    Au: 0.02um - 0.1um  
  ENIG Ni: 1.0 - 6.0um  
    Au: 0.015um - 0.10um  
  Tshuaj pleev nyiaj Ag: 0.1 - 0.3um  
  Plating Tin Sn: 5um - 35um  
SMT Hom 0.3mm taub suab sib txuas  
    0.4 hli suab BGA / QFP / QFN  
    0201 Lub Cheebtsam