Competitive PCB Chaw tsim tshuaj paus

Qhov project Cov ntsiab lus Capabibty

1

pawg thawj coj saib xyuas Aluminium Base, Copper Base, Ceramics Base tooj liab, Combined Bade Board

2

khoom Khoom siv hauv tsev.Aumestic tooj liab, imported aluminium, imported tooj liab

3

kho saum npoo HASL/ENIG/OSP/sikering

4

txheej account ib leeg-sided pnnted board / ob-sided luam ntawv board

5

Maxi.Board Loj 1200mm * 480m (n

6

min. Board Loj 5mm * 5 hli

7

kab dav / apsce 0.1mnV 0.1 hli

8

warp thiab twist <= 0.5% (tfiickness: 1 .Omm, Board Loj: 300mm * 300mm)

9

Board thickness 0.5mm-5.0 hli

10

tooj liab foil thickness 35urrV70um/105um/140um/175umV210um/245um/280um/315um/35Qjm

11

kam rau ua CNC routing: ± 0.1 hli; Punch: ± 0.1 hli

12

V-CUT sau npe ± 0.1 hli

13

Qhov phab ntsa tooj liab thickness 20-35 hli

14

mm sau npe ntawm qhov chaw (campare nrog CAD cov ntaub ntawv) ± 3mil (10.076 hli)

15

Min. punching qhov 1.0mm (Pib thickness bebw1.0mmr1.0 hli)

16

Min. punching square qhov (Pib thickness hauv qab 1 .Omm, 1.0mm * 1 .Omm)

17

Kev sau npe ntawm cov ntawv luam tawm ± 0.076 hli

18

Min.drill qhov taub 0.6mm ib

19

thickness ntawm kev kho deg Plating kub: Ni 4um-6um>Au0.1um-0.5umENIG: Ni 5um-6um, Au: 0.0254um-0.127umsilvering: Ag3um-8umHASL: 40um-1 OOum

20

V-CUTdegree kam rau ua (Degree)

21

V-CUT board thickness 0.6mm-4.0 hli

22

Min.lus dab neeg dav 0.15 hli

23

Min.Soldor daim npog qhov ncauj qhib 0.35 hli