| Cov khoom | Muaj peev xwm |
| Txheej suav | 1-40 txheej |
| Laminates hom | FR-4 (High Tg, Halogen Dawb, Ntau zaus) |
| FR-5, CEM-3, PTFE, BT, Getek, Aluminium puag, tooj liab puag, KB, Nanya, Shengyi, ITEQ, ILM, Isola, Nelco, Rogers, Arlon |
| Board thickness | 0.2 hli-6mm |
| Max Base tooj liab hnyav | 210um (6oz) rau txheej txheej 210um (6oz) rau txheej txheej |
| Min mechanical laum loj | 0.2 hli (0.008 ") |
| Aspect ratio | 12:01 Nws |
| Max vaj huam sib luag loj | Sigle sab los yog ob sab: 500mm * 1200mm, |
| Multilayer txheej: 508mm X 610mm (20 "X 24") |
| Min kab dav / qhov chaw | 0.076 hli / 0.0.076 hli (0.003 "/ 0.003") |
| Ntawm qhov hom | Qhov muag tsis pom / Burried / Plugged (VOP, VIP…) |
| HDI / Microvia | YOG |
| Nto tiav | HASL |
| Lead Free HASL |
| Immersion Kub (ENIG), Immersion Tin, Immersion Silver |
| Organic Solderability Preservative (OSP) / ENTEK |
| Flash Kub (Hard Gold plating) |
| ENEPIG |
| Xaiv Kub Plating, Kub thickness mus txog 3um (120u ") |
| Kub ntiv tes, Carbon Sau, Peev S / M |
| Solder mask xim | Ntsuab, Xiav, Dawb, Dub, Ntshiab, thiab lwm yam. |
| Impedance | Ib kab, qhov sib txawv, coplanar impedance tswj ± 10% |
| Txheej txheem tiav hom | CNC Routing; V-Scoring / Txiav; Punch |
| Tolerances | Min Hole kam rau ua (NPTH) | ± 0.05 hli |
| Min Hole kam rau ua (PTH) | ± 0.075 hli |
| Min Hom kam rau ua | ± 0.05 hli |
