| Xaiv | cov khoom | Muaj peev xwm | Muaj peev xwm tshwj xeeb |
| txheej suav | Rigid-flex PCB | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| lub rooj tsavxwm | 0.08 +/- 0.03 hli | 0.05 +/- 0.03 hli | |
| Min. Thickness | |||
| Max. Thickness | 6mm ib | 8mm ib | |
| Max. Loj | 485mm * 1000mm | 485mm * 1500mm | |
| Qhov & Qhov | Min.Hole | 0.15 hli | 0.05 hli |
| Min.Slot Qhov | 0.6mm ib | 0.5 hli | |
| Aspect Ratio | 10:01 ib | 12:01 Nws | |
| Kab | Min. Dav / Qhov chaw | 0.05 / 0.05 hli | 0.025 / 0.025 hli |
| Ua siab ntev | Trace W/S | ± 0.03 hli | ± 0.02 hli |
| (W / S ≥0.3mm: ± 10%) | (W / S ≥0.2mm: ± 10%) | ||
| Qhov rau qhov | ± 0.075 hli | ± 0.05 hli | |
| Qhov Dimension | ± 0.075 hli | ± 0.05 hli | |
| Impedance | 0 ≤ Tus nqi ≤ 50Ω : ± 5Ω 50Ω ≤ Tus Nqi : ± 10%Ω | ||
| Khoom siv | Basefilm Specification | PI: 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED & RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Main tsum | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Coverlay Specification | PIB: 2mil 1mil 0.5mil | ||
| LPI Xim | Ntsuab / Daj / Dawb / Dub / Xiav / Liab | ||
| PIB Stiffener | T: 25um ~ 250um | ||
| FR4 Stiffer | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener IB | T: 100um ~ 1600um | ||
| Daim kab xev | 3M / Tesa / Nitto | ||
| EMI tiv thaiv | Nyiaj zaj duab xis / tooj liab / nyiaj number case | ||
| Nto tiav | OSP | 0.1-0.3 hli | |
| HASL | Ntev: 5-40um | ||
| HASL (Lee dawb) | Ntev: 5-40um | ||
| ENEPIG | Ntev: 1.0-6.0um | ||
| Ba: 0.015-0.10um | |||
| Au: 0.015 - 0.10um | |||
| Plating nyuaj kub | Ntev: 1.0-6.0um | ||
| Dav: 0.02 hli - 1 hli | |||
| Flash kub | Ntev: 1.0-6.0um | ||
| Ntev: 0.02-0.1um | |||
| ENIG | Ntev: 1.0-6.0um | ||
| Au: 0.015um - 0.10um | |||
| Immion nyiaj | Ntev: 0.1-0.3um | ||
| Plating Tin | Loj: 5-35um | ||
| SMT | Hom | 0.3mm suab Connectors | |
| 0.4mm suab BGA / QFP / QFN | |||
| 0201 Ib |