Cov khoom | Muaj peev xwm |
pawg thawj coj saib xyuas | Aluminium Base, tooj liab Base, Hlau Base, ceramics puag tooj liab-clad, Combined Bade Board |
khoom | Hauv tsev Aluminium, tooj liab, lmported aluminium, lmported tooj |
kho saum npoo | HASL/ENIG/OSP/silvering |
txheej account | ib leeg-sided printed board/ob-sided printed board |
Maxi.board Loj | 1200mm * 480mm |
min.board Loj | 5mm * 5 hli |
taug dav / apsce | 0.1mm / 0.1 hli |
warp thiab twist | <= 0.5% (thickness: 1.6 hli, Board Loj: 300mm * 300mm) |
Board thickness | 0.5mm-5.0 hli |
tooj liab dag thickness | 35um/70um/105um/140um/175um/210um /245um/280um/315um/350um |
V-CUT degree kam rau ua | CNC routing: ± 0.1 hli; Punch: ± 0.1 hli |
V-CUT sau npe | ± 0.1 hli |
Qhov phab ntsa tooj liab thickness | 20-35 hli |
Min sau npe ntawm qhov chaw (campare nrog CAD cov ntaub ntawv) | ± 3mil (± 0.076 hli) |
Min. punching qhov | 1.0mm hauv qab, 1.0mm (Board thickness hauv qab 1.0mm, 1.0mm) |
Min. xuas nrig ntaus square qhov | 1.0mm hauv qab, 1.0mm * 1.0mm (Pib thickness hauv qab 1.0mm, 1.0mm * 1.0mm) |
Kev sau npe ntawm cov ntawv luam tawm | ± 0.076 hli |
Min.drill qhov taub | 0.6mm ib |
thickness ntawm kev kho deg | Plating kub: Ni 4um-6um, Au0.1um-0.5um ENIG: Ni 5um-6um, Au: 0.0254um-0.127um silvering: Ag3um-8um HASL: 40um-100um |
V-CUTdegree kam rau ua | ± 5 (Degree) |
V-CUT board tuab | 0.6mm-4.0 hli |
Min.Lefend dav | 0.15 hli |
Min.Solder daim npog qhov ncauj qhib | 0.35 hli |