Daim ntawv ceeb toom ntawm tuav "Component Failure Analysis Technology and Practice Case" Application analysis Senior Seminar

 

Lub koom haum thib tsib ntawm Electronics, Ministry of Industry thiab Information Technology

Enterprises thiab cov koom haum:

Txhawm rau pab cov engineers thiab cov kws tshaj lij paub txog cov teeb meem kev lag luam thiab kev daws teeb meem ntawm kev tsom xam tsis ua hauj lwm thiab PCB & PCBA tsis ua hauj lwm tsom xam nyob rau hauv lub sij hawm luv tshaj;Pab cov neeg ua haujlwm muaj feem cuam tshuam hauv kev lag luam kom nkag siab thiab txhim kho cov qib kev sib raug zoo kom ntseeg tau tias muaj txiaj ntsig thiab kev ntseeg siab ntawm cov txiaj ntsig kev xeem.Lub Tsev Haujlwm Thib tsib ntawm Electronics ntawm Ministry of Industry thiab Information Technology (MIIT) tau tuav ib txhij hauv online thiab offline thaum lub Kaum Ib Hlis 2020 raws li:

1. Online thiab offline synchronization ntawm "Component Failure Analysis Technology and Practical Cases" Application analysis Senior Rhiav.

2. Tuav cov khoom siv hluav taws xob PCB & PCBA kev ntseeg siab tsis ua hauj lwm kev soj ntsuam thev naus laus zis xyaum ua cov ntaub ntawv txheeb xyuas hauv online thiab offline synchronization.

3. Online thiab offline synchronization ntawm ib puag ncig kev cia siab rau kev sim thiab kev ntseeg siab Performance index txheeb xyuas thiab nyob rau hauv-tob tsom xam ntawm hluav taws xob khoom tsis ua hauj lwm.

4. Peb tuaj yeem tsim cov chav kawm thiab npaj kev cob qhia sab hauv rau cov lag luam.

 

Cov ntsiab lus kev cob qhia:

1. Taw qhia txog kev soj ntsuam tsis ua haujlwm;

2. Kev soj ntsuam tsis ua haujlwm ntawm cov khoom siv hluav taws xob;

2.1 Cov txheej txheem tseem ceeb rau kev txheeb xyuas qhov ua tsis tiav

2.2 Txoj kev yooj yim ntawm kev txheeb xyuas tsis muaj kev puas tsuaj

2.3 Txoj kev yooj yim ntawm kev tsom xam ib nrab

2.4 Txoj kev yooj yim ntawm kev soj ntsuam kev puas tsuaj

2.5 Tag nrho cov txheej txheem ntawm tsis ua hauj lwm tsom xam cov ntaub ntawv ntsuam xyuas

2.6 Kev ua tsis tiav physics thev naus laus zis yuav tsum tau siv rau hauv cov khoom ntawm FA mus rau PPA thiab CA

3. Cov cuab yeej tsom xam tsis ua hauj lwm thiab kev ua haujlwm;

4. Cov hom tsis ua hauj lwm tseem ceeb thiab qhov ua tsis tiav ntawm cov khoom siv hluav taws xob;

5. Kev soj ntsuam tsis ua tiav ntawm cov khoom siv hluav taws xob loj, cov xwm txheej classic ntawm cov khoom tsis xws luag (chip tsis xws luag, siv lead ua tsis xws luag, nti passivation txheej tsis xws luag, kev sib koom ua ke, cov txheej txheem tsis xws luag, chip bonding defects, imported RF khoom - thermal qauv tsis xws luag, tshwj xeeb tsis xws luag, inherent qauv, Internal qauv tsis xws luag, khoom tsis xws luag; Kuj, capacitance, inductance, diode, triode, MOS, IC, SCR, circuit module, thiab lwm yam.)

6. Kev siv tsis ua haujlwm physics thev naus laus zis hauv cov khoom tsim

6.1 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev tsim hluav taws xob tsis raug

6.2 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev tiv thaiv kev sib kis mus ntev

6.3 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev siv cov khoom siv tsis raug

6.4 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev sib raug zoo ntawm cov qauv sib dhos thiab cov khoom siv

6.5 Cov teeb meem ua tsis tiav ntawm ib puag ncig adaptability thiab lub hom phiaj profile tsim teeb meem

6.6 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev sib txuam tsis raug

6.7 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev tsim qauv tsis zoo

6.8 Inherent mechanism thiab inherent tsis muaj zog ntawm kev tiv thaiv

6.9 Kev ua tsis tiav los ntawm kev faib khoom parameter

6.10 FAILURE cov teeb meem tshwm sim los ntawm PCB tsim teeb meem

6.11 Cov teeb meem ua tsis tiav tshwm sim los ntawm kev tsim cov teeb meem tuaj yeem tsim tau


Post lub sij hawm: Dec-03-2020