Competitive PCB Chaw tsim tshuaj paus

5.0W / MK High Thermal Conductivity MCPCB Rau toj roob hauv pes teeb

Lus piav qhia luv luv:

Hlau hom: Aluminium puag

Number ntawm txheej: 1

Nto:ENIG


Product Detail

Khoom cim npe

Taw qhia ntawm MCPCB

MCPCB yog cov ntawv luv ntawm Hlau core PCBs, suav nrog txhuas raws PCB, tooj liab raws PCB thiab hlau raws PCB.

Aluminium raws board yog hom ntau tshaj plaws.Cov khoom siv hauv paus muaj cov tub ntxhais aluminium, tus qauv FR4 thiab tooj liab.Nws nta ib txheej thermal clad uas dissipates tshav kub nyob rau hauv ib tug heev npaum txoj kev thaum txias Cheebtsam.Tam sim no, Aluminium Raws li PCB raug suav hais tias yog kev daws teeb meem rau lub zog siab.Aluminium raws li lub rooj tsavxwm tuaj yeem hloov cov frangible ceramic raws li lub rooj tsavxwm, thiab txhuas muab lub zog thiab ruaj khov rau cov khoom uas cov hauv paus ceramic tsis tuaj yeem.

Copper substrate yog ib qho ntawm cov khoom kim tshaj plaws hlau substrates, thiab nws cov thermal conductivity yog ntau zaus zoo dua li ntawm aluminium substrates thiab hlau substrates.Nws yog qhov tsim nyog rau qhov ua tau zoo tshaj plaws cua sov dissipation ntawm high zaus circuits, Cheebtsam nyob rau hauv cov cheeb tsam nrog zoo variation nyob rau hauv siab thiab tsis kub thiab precision khoom sib txuas lus.

Thermal rwb thaiv tsev txheej yog ib qho tseem ceeb ntawm tooj liab substrate, yog li lub thickness ntawm tooj liab ntawv ci feem ntau yog 35 m-280 m, uas muaj peev xwm ua tau ib tug muaj zog tam sim no-nqa peev xwm.Piv nrog rau aluminium substrate, tooj liab substrate tuaj yeem ua tiav cov nyhuv thermal dissipation zoo dua, thiaj li ua kom cov khoom ruaj khov.

Cov qauv ntawm Aluminium PCB

Circuit Copper Txheej

Lub Circuit Court tooj liab txheej yog tsim thiab etched los ua ib tug luam Circuit Court, lub txhuas substrate muaj peev xwm nqa tau ib tug ntau dua tam sim no tshaj tib tuab FR-4 thiab tib kab dav.

Insulating Txheej

Cov txheej txheej insulating yog cov thev naus laus zis tseem ceeb ntawm aluminium substrate, uas feem ntau plays lub luag haujlwm ntawm rwb thaiv tsev thiab kub conduction.Aluminium substrate insulating txheej yog qhov loj tshaj plaws thermal thaiv nyob rau hauv lub zog module qauv.Qhov zoo dua cov thermal conductivity ntawm cov txheej insulating, qhov zoo dua nws yog kom kis tau cov cua sov tsim thaum lub sijhawm ua haujlwm ntawm lub cuab yeej, thiab qhov ntsuas kub ntawm cov cuab yeej qis dua,

Hlau substrate

Dab tsi ntawm cov hlau peb yuav xaiv ua cov insulating hlau substrate?

Peb yuav tsum xav txog cov thermal expansion coefficient, thermal conductivity, lub zog, hardness, hnyav, deg lub xeev thiab tus nqi ntawm cov hlau substrate.

Feem ntau, aluminium yog qhov sib piv pheej yig dua tooj liab.Muaj cov khoom siv txhuas yog 6061, 5052, 1060 thiab lwm yam.Yog tias muaj cov kev xav tau ntau dua rau cov thermal conductivity, cov khoom siv hluav taws xob, cov khoom siv hluav taws xob thiab lwm yam khoom tshwj xeeb, cov phaj tooj liab, stainless hlau daim hlau, hlau daim hlau thiab silicon steel daim hlau kuj tseem siv tau.

Daim ntawv thov ntawmMCPCB

1. Suab: input, output amplifier, balanced amplifier, audio amplifier, power amplifier.

2. Fais fab mov: Hloov regulator, DC / AC converter, SW regulator, thiab lwm yam.

3. Tsheb: hluav taws xob regulator, ignition, fais fab mov tswj, thiab lwm yam.

4. Khoos phis tawj: CPU board, floppy disk drive, cov khoom siv hluav taws xob, thiab lwm yam.

5. Fais fab Modules: Inverter, solid-state relays, rectifier txuas hniav.

6. Teeb thiab teeb pom kev zoo: lub teeb txuag hluav taws xob, ntau yam xim muaj zog txuag LED teeb, teeb pom kev sab nraum zoov, theem teeb pom kev zoo, qhov chaw teeb pom kev zoo

MCPCB

8W / mK siab thermal conductivity txhuas raws li PCB

Hlau hom: Aluminium puag

Number ntawm txheej:1

Nto:Lead dawb HASL

Phaj thickness:1.5 hli

Copper thickness:3 5 awm

Thermal conductivity:8 W/mk

Thermal tsis kam:0.015 ℃ / W

Hlau hom: Aluminiumpuag

Number ntawm txheej:2

Nto:OSP

Phaj thickness:1.5 hli

Copper thickness: 35um

Hom txheej txheem:Thermoelectric sib cais tooj liab substrate

Thermal conductivity:PEB 398 W/mk

Thermal tsis kam:0.015 ℃ / W

Tswv yim tsim:Kev taw qhia ncaj qha hlau, tooj liab thaiv qhov chaw tiv tauj yog qhov loj, thiab cov xaim me me.

MCPCB-1

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