Competitive PCB Chaw tsim tshuaj paus

Thaum qhov kub ntawm Tg Circuit Court board nce mus rau ib cheeb tsam, lub substrate yuav hloov los ntawm "iav xeev" mus rau "lub xeev roj hmab", thiab qhov kub ntawm lub sij hawm no yog hu ua lub iav hloov kub (Tg) ntawm lub phaj. Hauv lwm lo lus, Tg yog qhov kub siab tshaj (℃) uas lub substrate tseem nruj. Qhov ntawd yog hais tias, zoo tib yam PCB substrate khoom ntawm qhov kub thiab txias tsis tsuas yog tsim softening, deformation, melting thiab lwm yam phenomena, tab sis kuj qhia ib tug ntse poob rau hauv txhua yam thiab hluav taws xob khoom (Kuv tsis xav tias koj xav pom lawv cov khoom tshwm sim rooj plaub no. ).

General Tg daim hlau yog tshaj 130 degrees, siab Tg feem ntau yog ntau tshaj 170 degrees, thiab nruab nrab Tg yog hais txog ntau tshaj 150 degrees.

Feem ntau, PCB nrog Tg≥170 ℃ yog hu ua siab Tg Circuit Court board.

Lub Tg ntawm lub substrate nce, thiab lub tshav kub tsis kam, noo noo tsis kam, tshuaj tsis kam, stability tsis kam thiab lwm yam ntxwv ntawm lub Circuit Court board yuav raug txhim kho thiab txhim kho. Qhov siab dua TG tus nqi yog, qhov zoo dua qhov kub thiab txias ua haujlwm ntawm lub phaj yuav zoo dua. Tshwj xeeb tshaj yog nyob rau hauv cov txheej txheem tsis muaj txhuas, siab TG feem ntau siv.

High Tg hais txog kev kub siab ua haujlwm. Nrog rau txoj kev loj hlob sai ntawm kev lag luam hluav taws xob, tshwj xeeb tshaj yog cov khoom siv hluav taws xob uas sawv cev los ntawm cov khoos phis tawj, ntawm kev txhim kho kev ua haujlwm siab, siab multilayer, xav tau PCB substrate cov khoom siv hluav taws xob ntau dua li qhov tseem ceeb lav. Kev tshwm sim thiab kev loj hlob ntawm high density installation technology sawv cev los ntawm SMT thiab CMT ua rau PCB ntau thiab ntau nyob ntawm qhov kev pab cuam ntawm kub kub tsis kam ntawm substrate nyob rau hauv cov nqe lus ntawm me me aperture, nplua hlau thiab nyias hom.

Yog li ntawd, qhov sib txawv ntawm qhov zoo tib yam FR-4 thiab high-TG FR-4 yog tias nyob rau hauv lub thermal lub xeev, tshwj xeeb tshaj yog tom qab hygroscopic thiab rhuab, lub zog txhua yam, seem stability, adhesion, dej nqus, thermal decomposition, thermal expansion thiab lwm yam kev mob. cov ntaub ntawv sib txawv. High Tg cov khoom yog pom tseeb zoo dua li cov khoom siv PCB substrate. Nyob rau hauv xyoo tas los no, tus naj npawb ntawm cov neeg siv khoom xav tau siab Tg Circuit Board tau nce xyoo los ntawm xyoo.