Kev Sib Tw PCB Chaw Tsim Tshuaj

ceev multilayer High Tg Board nrog immersion kub rau modem

Cov lus piav qhia luv luv:

Cov khoom siv hom: FR4 Tg170

Txheej txheej: 4

Min kab dav / qhov chaw: 6 mil

Lub qhov me me: 0.30mm

Tiav pawg thawj coj saib thickness: 2.0mm

Tiav tooj liab tooj tuab: 35um

Xaus: ENIG

Solder daim npog xim: ntsuab “

Lub sij hawm ua: 12 hnub


Khoom Nthuav dav

Cov khoom lag luam

Cov khoom siv hom: FR4 Tg170

Txheej txheej: 4

Min kab dav / qhov chaw: 6 mil

Lub qhov me me: 0.30mm

Tiav pawg thawj coj saib thickness: 2.0mm

Tiav tooj liab tooj tuab: 35um

Xaus: ENIG

Daim npog ntsej muag xim: ntsuab ntsuab `

Lub sij hawm ua: 12 hnub

High Tg board

Thaum qhov kub ntawm siab Tg Circuit Court nce mus rau ib cheeb tsam twg, lub hauv qab yuav hloov los ntawm "iav xeev" rau "roj hmab xeev", thiab qhov kub nyob rau lub sijhawm no hu ua lub khob hloov kub (Tg) ntawm lub phaj. Hauv lwm lo lus, Tg yog qhov kub tshaj plaws (℃) thaum qhov substrate tseem ntuag. Uas yog hais, zoo tib yam PCB substrate cov khoom siv ntawm qhov kub thiab txias tsis tsuas yog tsim cov muag muag, deformation, melting thiab lwm yam tshwm sim, tab sis kuj qhia kev poob qis hauv cov khoom siv kho tshuab thiab hluav taws xob (Kuv tsis xav tias koj xav pom lawv cov khoom tshwm sim no )).

General Tg cov paib yog siab dua 130 degrees, siab Tg feem ntau tshaj 170 degrees, thiab Tg nruab nrab yog siab dua 150 degrees.

Feem ntau, Cov PCB nrog Tg≥170 ℃ yog hu ua siab Tg Circuit Court board.

Lub Tg ntawm cov pob zeb ci tuaj ntxiv, thiab cov cua kub tiv thaiv, noo noo tsis kam, tshuaj lom neeg tsis kam, kev ua haujlwm ruaj khov thiab lwm yam ntxwv ntawm lub rooj tsav xwm hauv Circuit Court yuav raug kho thiab txhim kho. Tus nqi TG ntau dua yog, qhov ntsuas kub zoo dua qhov ua haujlwm ntawm lub phaj yuav yog. Tshwj xeeb tshaj yog nyob rau hauv cov txheej txheem tsis muaj hmoov txhuas, TG siab feem ntau tau thov.

High Tg hais txog qhov kub kub ua hauj. Nrog txoj kev loj hlob sai ntawm kev lag luam hluav taws xob, tshwj xeeb tshaj yog cov khoom siv hluav taws xob sawv cev los ntawm lub koos pij tawj, mus rau txoj kev loj hlob ntawm qhov kev ua haujlwm siab, ntau dua multilayer, qhov xav tau rau PCB substrate cov khoom siv dua thaum tshav kub kub ua kev tiv thaiv tseem ceeb. Kev rov tshwm sim thiab kev loj hlob ntawm qhov siab ntom ntom thev naus laus zis nruab nrog los ntawm SMT thiab CMT ua rau PCB ntau dua thiab muaj kev vam khom rau kev txhawb nqa ntawm qhov kub siab ua haujlwm ntawm cov substrate nyob rau hauv cov nqe lus ntawm me aperture, zoo xov hlau thiab nyias hom.

Yog li ntawd, qhov sib txawv ntawm cov hluav taws xob FR-4 thiab high-TG FR-4 yog tias nyob rau hauv lub xeev thermal, tshwj xeeb yog tom qab hygroscopic thiab rhaub, qhov ua kom lub zog, dimensional stability, adhesion, nqus dej, thermal decomposition, thermal expansion thiab lwm yam mob ntawm cov khoom siv sib txawv. High Tg cov khoom lag luam yog pom tseeb zoo dua li cov txheej txheem PCB txheej txheem yooj yim. Xyoo tsis ntev los no, tus naj npawb ntawm cov neeg siv khoom uas xav tau Tg Circuit Court siab tau nce xyoo los ntawm xyoo.


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  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa rau peb

    KHOOM QAUV

    Tsom rau muab cov mong pu daws rau 5 xyoos.