Competitive PCB Chaw tsim tshuaj paus

Ceramic substrate hais txog tooj liab ntawv ntawm qhov kub siab ncaj qha rau txhuas oxide (Al2O3) los yog aluminium nitride (AlN) ceramic substrate nto (ib zaug lossis ob npaug) txheej txheej tshwj xeeb phaj.Lub ultra-thin composite substrate muaj cov hluav taws xob rwb thaiv tsev zoo heev, thermal conductivity, zoo heev mos brazing khoom thiab siab adhesion zog, thiab muaj peev xwm etch txhua yam ntawm cov duab ib yam li PCB board, nrog zoo tam sim no nqa peev xwm.Yog li ntawd, ceramic substrate tau dhau los ua cov khoom siv tseem ceeb ntawm lub zog hluav taws xob hluav taws xob hluav taws xob hluav taws xob hluav taws xob thiab kev siv tshuab sib txuas.

Qhov zoo ntawm ceramic raws board:

Muaj zog mechanical stress, ruaj khov;Siab zog, siab thermal conductivity, siab rwb thaiv tsev;Muaj zog adhesion, tiv thaiv corrosion.

◆ Zoo thermal lub voj voog kev ua tau zoo, lub sij hawm voj voog mus txog 50,000 zaug, kev ntseeg siab.

◆ Cov qauv ntawm ntau cov duab tuaj yeem ua tau raws li PCB (lossis IMS substrate);Tsis muaj kuab paug, tsis muaj kuab paug.

◆ Qhov kev pabcuam kub yog -55 ℃ ~ 850 ℃;Lub thermal expansion coefficient yog ze rau silicon, uas yooj yim rau kev tsim cov txheej txheem ntawm lub zog module.

Daim ntawv thov ntawm ceramic raws board:

Ceramic substrates (alumina, aluminium nitride, silicon nitride, zirconia thiab zirconia toughening alumina uas yog ZTA) vim nws zoo heev thermal, mechanical, tshuaj, thiab dielectric zog, yog dav siv nyob rau hauv lub semiconductor nti ntim, sensors, kev sib txuas lus electronics, xov tooj ntawm tes thiab lwm lub davhlau ya nyob twg ntse, cov cuab yeej thiab cov ntsuas, lub zog tshiab, lub teeb ci tshiab, nws pib tsheb ciav hlau ceev, cua zog, neeg hlau, aerospace thiab kev tiv thaiv tub rog thiab lwm yam kev ua haujlwm siab.Raws li kev txheeb cais, txhua txhua xyoo ntau yam ceramic substrate tus nqi tau mus txog kaum tawm billions ntawm kev ua lag luam, tshwj xeeb tshaj yog nyob rau hauv xyoo tas los no, nrog rau Tuam Tshoj txoj kev loj hlob sai nyob rau hauv lub zog tshiab tsheb, high-speed rail thiab 5 g hauv paus chaw nres tsheb, ceramic substrate xav tau loj, tsuas yog nyob rau hauv lub tsheb. cheeb tsam, qhov kev thov kom muaj nuj nqis txhua xyoo yog txog li 5 lab PCS;Alumina ceramic substrate tsis yog tsuas yog siv dav hauv kev lag luam hluav taws xob thiab hluav taws xob, tab sis kuj nyob rau hauv lub siab sensor thiab LED tshav kub dissipation teb.

Maily siv nyob rau hauv cov nram qab no 5 arears:

1.IGBT module rau high-ceev railway tsheb, lub zog tshiab tsheb, cua zog tsim, neeg hlau thiab 5G hauv paus chaw nres tsheb;

2.Smart phone backplane thiab ntiv tes lees paub;

3.New tiam khoom roj hlwb;

4.New pav ca siab sensor thiab oxygen sensor;

5.LD / LED tshav kub dissipation, laser system, hybrid integrated circuit;